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OKI Semiconductor MR26V25605J
8M-Word x 32-Bit or 16M-Word x 16-Bit
FEDR26V25605J-02-03
Issue Date: Jul. 9, 2004
P2ROM
PIN CONFIGURATION (TOP VIEW) A0 1 A1 2 A2 3 A3 4 A4 5 A5 6 Vcc 7 D0 8 D16 9 D1 10 D17 11 Vss 12 Vcc 13 D2 14 D18 15 D3 16 D19 17 D4 18 D20 19 D5 20 D21 21 Vss 22 Vcc 23 D6 24 D22 25 D7 26 D23 27 Vss 28 A6 29 A7 30 A8 31 A9 32 A10 33 A11 34 A12 35
70 A22 69 A21 68 A20 67 WORD# 66 OE# 65 CE# 64 Vss 63 D31/A-1 62 D15 61 D30/A-1 60 D14 59 Vss 58 Vcc 57 D29 56 D13 55 D28 54 D12 53 D27 52 D11 51 D26 50 D10 49 Vss 48 Vcc 47 D25 46 D9 45 D24 44 D8 43 Vcc 42 A19 41 A18 40 A17 39 A16 38 A15 37 A14 36 A13
FEATURES
*8,388,608-word x 32-bit/16,777,216-word x 16-bit electrically switchable configuration * 3.0 V to 3.6 V power supply * Access time 90 ns MAX * Operating current 60 mA MAX * Standby current 50 A MAX * Input/Output TTL compatible * Three-state output
PACKAGES
* MR26V25605J-xxxMB 70-pin plastic SSOP (P-SSOP70-500-0.80-K-MC)
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MR26V25605J / P2ROM
BLOCK DIAGRAM
A-1(D30/A-1[61] AND D31/A-1[63])
x 16/x 32 Switch CE# CE OE# OE WORD#
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22
Row Decoder
Memory Cell Matrix 8M x 32-Bit or 16M x 16-Bit
Address Buffer
Column Decoder
Multiplexer
Output Buffer
D0 D2 D4 D6 D8 D10 D12 D14 D16 D18 D20 D22 D24 D26 D28 D30 D1 D3 D5 D7 D9 D11 D13 D15 D17 D19 D21 D23 D25 D27 D29 D31 In16-bit output mode, these pins are placed in a high-Z state and pin D31,D30 functions as the A-1 address pin.
PIN DESCRIPTIONS
Pin name D31 / A-1,D30/A-1 A0 to A22 D0 to D29 CE# OE# WORD# VCC VSS Address inputs Data outputs Chip enable input Output enable input Double word - Word select input Power supply voltage Ground Functions Data output / Address input
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FUNCTION TABLE
Mode Read (32-Bit) Read (16Bit) Output disable Standby CE# L L L H OE# L L H WORD# H L H L H L 3.3 V DOUT VCC D0 to D15 D16 to D29 DOUT Hi-Z Hi-Z Hi-Z L/H D30/A-1,D31/A-1
: Don't Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter Operating temperature under bias Storage temperature Input voltage Output voltage Power supply voltage Power dissipation per package Output short circuit current Symbol Ta Tstg VI VO VCC PD IOS Ta = 25C -- relative to VSS Condition -- Value 0 to 70 -55 to 125 -0.5 to VCC+0.5 -0.5 to VCC+0.5 -0.5 to 5 1.0 10 Unit C C V V V W mA
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70C) Parameter VCC power supply voltage Input "H" level Input "L" level Symbol VCC VIH VIL VCC = 3.0 to 3.6 V Condition Min. 3.0 2.2 -0.5 Typ. -- -- -- Max. 3.6 VCC+0.5 0.6 Unit V V V
Voltage is relative to VSS. : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.3 V, Ta = 25C, f = 1 MHz) Parameter Input WORD# Output Symbol CIN1 CIN2 COUT Condition VI = 0 V VO = 0 V Min. -- -- -- Typ. -- -- -- Max. 30 400 20 pF Unit
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ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 3.3 V 0.3 V, Ta = 0 to 70C) Parameter Input leakage current Output leakage current VCC power supply current (Standby) VCC power supply current (Read) Input "H" level Input "L" level Output "H" level Output "L" level Symbol ILI ILO ICCSC ICCST ICCA1 VIH VIL VOH VOL Condition VI = 0 to VCC VO = 0 to VCC CE# = VCC CE# = VIH CE# = VIL OE# = VIH tc = 90 ns -- -- IOH = -2 mA IOL = 2 mA Min. -- -- -- -- -- 2.2 -0.5 2.4 -- Typ. -- -- -- -- -- -- -- -- -- Max. 20 20 50 1 60 VCC+0.5 0.6 -- 0.4 Unit A A A mA mA V V V V
Voltage is relative to VSS. : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(VCC = 3.3 V 0.3 V, Ta = 0 to 70C) Parameter Address cycle time Address access time CE# access time OE# access time Output disable time Output hold time Symbol tC tACC tCE tOE tCHZ tOHZ tOH Condition -- CE# = OE# = VIL OE# = VIL CE #= VIL OE# = VIL CE# = VIL CE #= OE# = VIL Min. 90 -- -- -- 0 0 0 Max. -- 90 90 40 20 20 -- Unit ns ns ns ns ns ns ns
Measurement conditions Input signal level --------------------------------- 0 V/3 V Input timing reference level--------------------- 1/2Vcc Output load---------------------------------------- 50 pF Output timing reference level------------------- 1/2Vcc Output load
Output 50 pF (Including scope and jig)
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TIMING CHART (READ CYCLE)
32-Bit Read Mode (WORD# = VIH)
tC
A0 to A22
tC
tOH tCE
CE#
tACC tCHZ
tOE
OE#
tOH
tACC
D0 to D31 Hi-Z Valid Data
tOHZ
Valid Data Hi-Z
16-Bit Read Mode (WORD# = VIL)
tC
A-1 to A22
tC
tOH tCE
CE#
tACC tCHZ
tOE
OE#
tOH
tACC
D0 to D15 Hi-Z Valid Data
tOHZ
Valid Data Hi-Z
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OKI Semiconductor
MR26V25605J / P2ROM
P-SSOP70-500-0.80-K-MC
5
Notes for Mounting the Surface Mount Type Package
Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised
Epoxy resin 42 alloy Solder plating (5m) 2.15 TYP. 1/Nov. 13, 2002
(Unit: mm)
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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REVISION HISTORY
Document No. FEDR26V25605J-02-01 FEDR26V25605J-02-02 FEDR26V25605J-02-03
Page Date Previous Edition - 4 3 Current Edition - 4 3 Final edition 1 Change tCHZ, tOHZ to 20ns Add PD condition and IOS = 10mA Description
Nov., 2002 Jul. 31, 2003 Jul. 9, 2004
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NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd.
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